Some data for Snapdragon 845 from Qualcomm is reversed, which will be seen in future multi-vendor phone models. Recent information indicates that Qualcomm can be released in 845 before the end of this year, and we have information that it will be built with FinFET 10nm and not 7nm because they claim many rumors.
The Snapdragon 835 chipset model, based on the use of FinFET 10nm technology, is featured on some fantastic smartphones this year, and the Snapdragon 845 is expected to power the high-end 2018 phones such as the Samsung Galaxy S9, the LG G7, Xiaomi Mi 7 and so on and by extension as it is now written will be the second 10nm chipset from Qualcomm.
Note that this new chipset has not yet officially received the code name “845” from the well-known semiconductor manufacturer in the United States, but a few months ago, a reference “SDM845” was found in one of the Qualcomm components. ITC documents when filing a complaint against Apple. It is thought that it has improved the Kryo, Adreno GPU cores with improved AR, VR and XR features.
Qualcomm announced last year in November 2016 for the SD 835 model and we saw it for the first time in the Galaxy S8, and this year will be a good thing for Samsung because the new chipset will go first in the Galaxy S9 and S9 +.
Rumors describe how the Galaxy S9 will be released with the Exynos 9810 chipset integrated with Al capabilities and will be built on the 7nm or 8nm lithographic process.
